Packaging Methodology

Designed using SolidWorks 3D CAD software (customer approved model is created based on agreed upon requirements)

Structural, thermal, airflow, and mass analysis (subjected to EDA finite element analysis)

­ NIS has introduced a new advanced packaging technology known as Flatware, and intends to use carbon fiber (CF) material in their enclosure designs. The technology is still considered conceptual and can be used to effectively reduce weight, minimize size (composite PAN CF) to include improved thermal management (thermally conductive unidirectional PITCH CF).